vendor.sh: Handle FSP insertion post-release

The Libreboot 20241206 release provided FSP pre-assembled
and inserted into the ROM images; the only file inserted
by vendor.sh was the Intel ME.

Direct distribution of an unmodified FSP image is permitted
by Intel, provided that the license notice is given among
other requirements. Due to how coreboot works, it must split
up the FSP into subcomponents, and adjust certain pointers
within the -M component (for raminit).

Such build-time modifications are perfectly fine in a coreboot
context, where it is expected that you are building from source.
The end result is simply what you use.

In a distribution such as Libreboot, where we provide pre-built
images, this becomes problematic. It's a technicality of the
license, and it seems that Intel themselves probably intended
for Libreboot to use the FSP this way anyway, since it is they
who seem to be the author of SplitFspBin.py, which is the
utility that coreboot uses for splitting up the FSP image.

Due to the technicality of the licensing, the FSP shall now
be scrubbed from releases, and re-inserted.

Coreboot was inserting the -S component with LZ4 compression,
which is bad news for ./mk inject beacuse the act of compression
is currently not reproducible. Therefore, coreboot has been
modified not to compress this section, and the inject command
doesn't compress it either. This means that the S file is using
about 180KB in flash, instead of about 140KB. This is totally OK.

The _fsp targets are retained, but set to release=n, because these
targets *still* don't scrub fsp.bin; if released, they would
include fsp files, so they've been set to release=n. These can
be used on older Libreboot release archives, for compatibility.

The new ROM images released for the affected machines are:

t480_vfsp_16mb
t480s_vfsp_16mb
dell3050micro_vfsp_16mb

Note the use of _vfsp instead of _fsp. These images are released,
unlike _fsp, and they lack fspm/fsps in the image. FSP S/M must
be inserted using ./mk inject.

This has been tested and confirmed to boot just fine.
The 20241206 images will be re-compiled and re-uploaded with this
and other recent changes, to make Libreboot 20241206 rev8.

Signed-off-by: Leah Rowe <leah@libreboot.org>
This commit is contained in:
Leah Rowe
2024-12-26 17:11:10 +00:00
parent 7813205146
commit 12c6259cb2
24 changed files with 5258 additions and 29 deletions
@@ -0,0 +1,36 @@
From 68f16ef46890dd08a2d03034ad6f352699282e00 Mon Sep 17 00:00:00 2001
From: Leah Rowe <info@minifree.org>
Date: Thu, 26 Dec 2024 19:45:20 +0000
Subject: [PATCH 1/1] soc/intel/skylake: Don't compress FSP-S
Build systems like lbmk need to reproducibly insert
certain vendor files on release images.
Compression isn't always reproducible, and making it
so costs a lot more time than simply disabling compression.
With this change, the FSP-S module will now be inserted
without compression, which means that there will now be
about 40KB of extra space used in the flash.
Signed-off-by: Leah Rowe <info@minifree.org>
---
src/soc/intel/skylake/Kconfig | 2 +-
1 file changed, 1 insertion(+), 1 deletion(-)
diff --git a/src/soc/intel/skylake/Kconfig b/src/soc/intel/skylake/Kconfig
index c24df2ef75..8e25f796ed 100644
--- a/src/soc/intel/skylake/Kconfig
+++ b/src/soc/intel/skylake/Kconfig
@@ -12,7 +12,7 @@ config SOC_INTEL_COMMON_SKYLAKE_BASE
select CPU_SUPPORTS_PM_TIMER_EMULATION
select DRIVERS_USB_ACPI
select EDK2_CPU_TIMER_LIB if PAYLOAD_EDK2
- select FSP_COMPRESS_FSP_S_LZ4
+# select FSP_COMPRESS_FSP_S_LZ4
select FSP_M_XIP
select GENERIC_GPIO_LIB
select HAVE_FSP_GOP
--
2.39.5